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https://idr.l2.nitk.ac.in/jspui/handle/123456789/6926| Title: | Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates |
| Authors: | Nayak, V.U. Prabhu, K.N. Stanford, N. Satyanarayan |
| Issue Date: | 2012 |
| Citation: | Transactions of the Indian Institute of Metals, 2012, Vol.65, 6, pp.713-717 |
| Abstract: | In the present study, wetting characteristics and evolution of microstructure of Sn-3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni-Sn, FeSn2 and lesser percentage of Fe-Cr-Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe-Cr-Sn IMCs. Presence of higher amount of Fe-Cr-Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy. |
| URI: | http://idr.nitk.ac.in/jspui/handle/123456789/6926 |
| Appears in Collections: | 2. Conference Papers |
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