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https://idr.l2.nitk.ac.in/jspui/handle/123456789/6926Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Nayak, V.U. | - |
| dc.contributor.author | Prabhu, K.N. | - |
| dc.contributor.author | Stanford, N. | - |
| dc.contributor.author | Satyanarayan | - |
| dc.date.accessioned | 2020-03-30T09:46:25Z | - |
| dc.date.available | 2020-03-30T09:46:25Z | - |
| dc.date.issued | 2012 | - |
| dc.identifier.citation | Transactions of the Indian Institute of Metals, 2012, Vol.65, 6, pp.713-717 | en_US |
| dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/6926 | - |
| dc.description.abstract | In the present study, wetting characteristics and evolution of microstructure of Sn-3.5Ag solder on Ag/Ni and Ni electroplated 304 stainless steel (304SS) substrates have been investigated. Solder alloy spread on Ag/Ni plated 304SS substrates exhibited better wetting as compared to Ni/304SS substrate. The formations of irregular shaped and coarser IMCs were found at the interface of solder/Ni/304SS substrate region whereas, solder/Ag/Ni/substrate interface showed continuous scallop and needle shaped IMCs. The precipitation of Ag3Sn, Ni-Sn, FeSn2 and lesser percentage of Fe-Cr-Sn IMCs were found at the interface of solder/Ag/Ni/substrate region whereas, solder/Ni/304 SS substrate exhibited predominantly FeSn2 and Fe-Cr-Sn IMCs. Presence of higher amount of Fe-Cr-Sn IMCs at the solder/Ni/304SS substrate interface inhibited the further wetting of solder alloy. | en_US |
| dc.title | Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substrates | en_US |
| dc.type | Book chapter | en_US |
| Appears in Collections: | 2. Conference Papers | |
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