Please use this identifier to cite or link to this item: https://idr.l2.nitk.ac.in/jspui/handle/123456789/14882
Title: Influence of extender on Thermo-mechanical Properties of melamine-urea-formaldehyde [MUF] for wood adhesive applications
Authors: Nagamadhu M.
Ravi Kumar S.
Suraj R.
Manjunath Iyer K.B.
Mohan Kumar G.C.
Issue Date: 2019
Citation: Materials Today: Proceedings , Vol. 24 , , p. 2274 - 2282
Abstract: Now a day's many researchers are trying to build alternative materials for raw wood, by using wood composite materials as an alternative. However, in wood polymer composites major limitations on adhesive materials and its bonding strength effect with economy. In this paper melamine-urea-formaldehyde (MUF) wood adhesive properties were determined over a range of temperature. MUF prepared by considering 1:2.3 weight ratio of urea to the formalin, at 90°C and pH is adjusted to 7.5-8.0 and second urea is added at certain time interval to reduce the formaldehyde emission. MUF has certain properties like flow time, viscosity, solid content, water tolerance, shelf life which is calculated by the observation made. The cost of MUF adhesive can be controlled by adding extender (Maida). As wood polymer composites subjected to over a range of temperature. It's necessary to understand the thermo-mechanical properties of MUF reinforced with Maida as an extender using Dynamic Mechanical Analyzer (DMA). The DMA gives in-phase component like storage modulus, loss modules and tan delta. The results show that storage modulus increases with adding extender even at higher temperature, these shows that by adding extender MUF resist the intermolecular motion. The damping factors were found to be increases by adding extender. Tan delta of MUF exhibiting narrow peak with higher magnitude indicates more energy dissipates, by adding the extender it reduces. The adding extender Maida (MD) water absorption decreases, this shows better MUF having better bonding with extender. © 2019 Elsevier Ltd.
URI: https://doi.org/10.1016/j.matpr.2020.03.755
http://idr.nitk.ac.in/jspui/handle/123456789/14882
Appears in Collections:2. Conference Papers

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