Please use this identifier to cite or link to this item: https://idr.l2.nitk.ac.in/jspui/handle/123456789/12742
Title: Rapid thermal processing for ULSI applications: An overview
Authors: Reid, K.G.
Sitaram, A.R.
Issue Date: 1996
Citation: Solid State Technology, 1996, Vol.39, 2, pp.63-74
Abstract: Rapid thermal processing (RTP) technology has made significant advances in recent years. Dynamic feedback, multizone control, and axially symmetric chamber design have helped to improve manufacturability and process control. This article will discuss historical and state-of-the-art RTP technology. Throughput and cycle time for conventional CMOS processes in RTP and batch furnaces will be compared. Cost of ownership (COO) for thermal processors will be discussed, highlighting the importance of throughput.
URI: http://idr.nitk.ac.in/jspui/handle/123456789/12742
Appears in Collections:1. Journal Articles

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