Please use this identifier to cite or link to this item: https://idr.l2.nitk.ac.in/jspui/handle/123456789/8823
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dc.contributor.authorNarendran, G.
dc.contributor.authorGnanasekaran, N.
dc.contributor.authorArumuga, Perumal, D.
dc.date.accessioned2020-03-30T10:22:48Z-
dc.date.available2020-03-30T10:22:48Z-
dc.date.issued2019
dc.identifier.citation2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, 2019, Vol., , pp.-en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/8823-
dc.description.abstractThe heat spreader integrated microchannel heat sink is employed in thermal management of transient hotspot problem in multicore processors for high density electronic cooling application. The heat transfer characteristics of heat spreader integrated microchannel were comprehensively analyzed experimentally and numerically, and their effectiveness and thermal enhancement factor was compared with the regular microchannel. By using deionized water and Graphene oxide (GO) nanofluid as working fluid, investigations were conducted for Reynolds number ranging from 100-300. Multiple hotspot cores were modelled in the microchannel with four different heat fluxes to study the temperature responses in the heat spreader under transient thermal loads. Additionally, studies were conducted to address the thermal stress developed in the packaging of heat spreader integrated microchannel in multiple hotspot conditions. The result shows that the thermal effectiveness of GO-0.12% increased 65% as compared with pure fluid. � 2019 IEEE.en_US
dc.titleMigration of flow inducted hotspot with heat spreader integrated microchannel subjected to asymmetric heat flux: A Multiphysics approachen_US
dc.typeBook chapteren_US
Appears in Collections:2. Conference Papers

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