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dc.contributor.authorSathyabhama, A.
dc.contributor.authorPrashanth, S.P.
dc.date.accessioned2020-03-30T10:18:51Z-
dc.date.available2020-03-30T10:18:51Z-
dc.date.issued2014
dc.identifier.citationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2014, Vol., , pp.466-472en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/8499-
dc.description.abstractThis paper presents the experimental investigation of pool boiling heat transfer performance of copper plain and grooved horizontal circular surfaces immersed in saturated water at atmospheric pressure. Effect of geometric parameters of the groove on boiling heat transfer coefficient was studied. Experimental results showed significant increase in boiling heat transfer coefficients at high heat flux with the provision of grooves. An increase in boiling heat transfer was observed with increase in fin thickness and groove depth. � 2014 IEEE.en_US
dc.titleExperimental investigation on boiling heat transfer coefficient enhancement using grooves for cooling of electronic devicesen_US
dc.typeBook chapteren_US
Appears in Collections:2. Conference Papers

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