Please use this identifier to cite or link to this item: https://idr.l2.nitk.ac.in/jspui/handle/123456789/14933
Full metadata record
DC FieldValueLanguage
dc.contributor.authorAgrawal A.
dc.contributor.authorChandrakar S.
dc.contributor.authorSharma A.
dc.date.accessioned2021-05-05T10:16:01Z-
dc.date.available2021-05-05T10:16:01Z-
dc.date.issued2020
dc.identifier.citationIOP Conference Series: Materials Science and Engineering , Vol. 840 , 1 , p. -en_US
dc.identifier.urihttps://doi.org/10.1088/1757-899X/840/1/012011
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/14933-
dc.description.abstractHybrid composite i.e. surface modified hexagonal boron nitride (hBN) and short sisal fiber reinforced in epoxy matrix is fabricated using hand lay-up method. The effect of surface modified hBN filler and sisal fiber content on mechanical and thermal properties of epoxy based hybrid composites were investigated in this paper. The main aim of the investigation is to develop a material which can found its application in microelectronic components. As per the requirement of microelectronic industry, the material should possess high thermal conductivity. Hence, thermal conductivity of epoxy increases with increase in hexagonal boron nitride content. Inspite of insulative nature of sisal fiber, the study shows that its inclusion in combination with hBN enhances the thermal conductivity if the content of both the fillers were properly selected. Other thermal property like coefficient of thermal expansion and glass transition temperature appreciably improves when combination of fillers were added in epoxy matrix. Mechanical properties under study i.e. tensile strength and compressive strength also enhances when combination of sisal fiber and hBN were incorporated as compared to when single filler hBN were used. Hence, usage of hybrid filler as reinforcement in epoxy improve overall mechanical and thermal property of the developed material. © 2020 Published under licence by IOP Publishing Ltd.en_US
dc.titleMechanical and Thermal Behaviour of Epoxy/Hexagonal Boron Nitride/Short Sisal Fiber Hybrid Compositesen_US
dc.typeConference Paperen_US
Appears in Collections:2. Conference Papers

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.