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dc.contributor.authorKalgudi S.
dc.contributor.authorPavithra G.P.
dc.contributor.authorPrabhu K.N.
dc.contributor.authorKoppad P.G.
dc.contributor.authorVenkate Gowda C.
dc.contributor.authorSatyanarayan
dc.date.accessioned2021-05-05T10:15:44Z-
dc.date.available2021-05-05T10:15:44Z-
dc.date.issued2019
dc.identifier.citationMaterials Today: Proceedings , Vol. 35 , , p. 295 - 297en_US
dc.identifier.urihttps://doi.org/10.1016/j.matpr.2020.01.379
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/14757-
dc.description.abstractSuper-hydrophobic surfaces are very useful in cleaning activities. Surfaces with water contact angles above 150° are regarded as superhydrophobic surfaces. In the present study an attempt has been made to achieve superhydrophobicity on copper substrate by electrochemical etching and electro-deposition of Co-Ni alloy and Co-Ni-Graphene composite. A contact angle of about 105° was obtained on Cu surface with electro-deposited Co-Ni alloy and on electro-deposited Co-Ni-G alloy contact angle was found to be 106°. The contact angle was significantly higher at about 142° with electro etched surface. Corrosion test was carried out with electrochemically etched Cu. Electrochemical etching time was varied from 30 to 240 min. The electro-etched Cu substrate etched for 60 min. showed better corrosion resistance with a corrosion rate of 0.197 mm/year. The surface topography of both etched and electrodeposited samples was studied by atomic force microscopy (AFM) and the results were correlated with the wettability data. © 2019 Elsevier Ltd.en_US
dc.titleEffect of surface treatment on wetting behavior of copperen_US
dc.typeConference Paperen_US
Appears in Collections:2. Conference Papers

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