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DC Field | Value | Language |
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dc.contributor.author | Tikale, S. | - |
dc.contributor.author | Prabhu, K.N. | - |
dc.date.accessioned | 2020-03-31T08:42:39Z | - |
dc.date.available | 2020-03-31T08:42:39Z | - |
dc.date.issued | 2018 | - |
dc.identifier.citation | Transactions of the Indian Institute of Metals, 2018, Vol.71, 11, pp.2693-2698 | en_US |
dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/13000 | - |
dc.description.abstract | The evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01 0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01 0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307 0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix. 2018, The Indian Institute of Metals - IIM. | en_US |
dc.title | Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles | en_US |
dc.type | Article | en_US |
Appears in Collections: | 1. Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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9 Performance of MWCNT.pdf | 1.48 MB | Adobe PDF | View/Open |
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