Please use this identifier to cite or link to this item: https://idr.l2.nitk.ac.in/jspui/handle/123456789/11950
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dc.contributor.authorManjunath, G.
dc.contributor.authorPujar, P.
dc.contributor.authorGupta, B.
dc.contributor.authorGupta, D.
dc.contributor.authorMandal, S.
dc.date.accessioned2020-03-31T08:35:58Z-
dc.date.available2020-03-31T08:35:58Z-
dc.date.issued2019
dc.identifier.citationJournal of Materials Science: Materials in Electronics, 2019, Vol.30, 20, pp.18647-18658en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/11950-
dc.description.abstractIn this contribution, screen printing of aqueous based particle-free silver ink is addressed using combustion chemistry, where inks embody a redox mixture of silver nitrate and citric acid in the presence of a binder, sodium-carboxymethylcellulose. The exothermic reaction at ~ 176 C results in the formation of pure silver. Screen-printing process is optimized for three different silver loadings (14%, 18% and 22%) in ink. In depth rheological study of the inks reveals thixotropic nature and the ink with 18% of silver possessing a viscosity of 328 Pa.s has a recovery rate of 84% at 110 s with a shear rate of 1 s?1. The deposited silver films (~ 3 m thick) on both rigid-glass and flexible-polyamide substrates have shown an electrical conductivity of 4.2 106 S m?1 and 2.6 106 S m?1 respectively. Film adhesion on glass substrates categorized under 3B as per ASTM D-3359. Present screen-printed silver films find their application as a gate electrode in thin film transistors (TFTs). The TFTs comprising of indium zinc tin oxide semiconductor and sodium ? -alumina dielectric with screen-printed silver as a gate electrode exhibited the saturation mobility, on:off ratio and threshold voltage of 0.88 cm2 V?1 s?1, 102 and ~ 0.3 V respectively. 2019, Springer Science+Business Media, LLC, part of Springer Nature.en_US
dc.titleLow-temperature reducible particle-free screen-printable silver ink for the fabrication of high conductive electrodesen_US
dc.typeArticleen_US
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