Browsing by Author Tikale, S.
Showing results 1 to 8 of 8
| Issue Date | Title | Author(s) | Supervisor(s) |
| 2018 | Assessment of the Performance of Sn 3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment | Samuel, A.; Tikale, S.; Prabhu, K.N. | - |
| 2017 | Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate | Tikale, S.; Sona, M.; Narayan, Prabhu, K. | - |
| 2019 | The effect of multi-walled carbon nanotubes reinforcement and multiple reflow cycles on shear strength of SAC305 lead-free solder alloy | Tikale, S.; Narayan, Prabhu, K. | - |
| 2018 | Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy | Tikale, S.; Prabhu, K.N. | - |
| 2018 | Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3 Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy | Tikale, S.; Narayan, Prabhu, K. | - |
| 2018 | Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles | Tikale, S.; Prabhu, K.N. | - |
| 2015 | Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate | Tikale, S.; Sona, M.; Prabhu, K.N. | - |
| 2019 | Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn�Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates | Sona, M.; Tikale, S.; Prabhu, N. | - |
